About Unisem
Unisem: A Global Leader in Semiconductor Assembly and Test Services
Unisem is a leading global provider of semiconductor assembly and test services, offering an integrated suite of services such as wafer bumping, wafer probing, wafer grinding, IC packaging, and high-end RF and mixed-signal test services. With over 30 years of experience in the industry, Unisem has established itself as a trusted partner to some of the world's largest semiconductor companies.
At Unisem, we understand that the semiconductor industry is constantly evolving. That's why we are committed to staying ahead of the curve by investing in state-of-the-art equipment and technology. Our facilities are equipped with advanced manufacturing equipment that allows us to provide our customers with high-quality products at competitive prices.
Wafer Bumping
Wafer bumping is a critical process in semiconductor manufacturing that involves adding metal bumps to the surface of a silicon wafer. These bumps serve as electrical contacts between the chip and its package. At Unisem, we offer both copper pillar bumping and solder bumping services.
Copper pillar bumping is a newer technology that offers several advantages over traditional solder bumping. Copper pillars are smaller than solder bumps, which allows for higher density interconnects on the chip. They also have better electrical performance than solder bumps due to their lower resistance.
Wafer Probing
Wafer probing is another critical process in semiconductor manufacturing that involves testing individual chips on a silicon wafer before they are packaged. This process helps identify any defects or issues with the chips before they are shipped out to customers.
At Unisem, we use advanced probe cards and testers to ensure accurate testing results for our customers' products. We also offer both manual and automated probing solutions depending on our customers' needs.
Wafer Grinding
After wafers have been bumped or probed, they need to be thinned down through grinding so that they can fit into their final package without taking up too much space. Wafer grinding requires precision equipment capable of removing just enough material from each side of the wafer without damaging it.
IC Packaging
IC packaging involves encapsulating individual chips into protective packages so that they can be easily handled during assembly into larger systems or devices such as smartphones or computers. At Unisem, we offer several types of IC packaging solutions including flip-chip bonding (FCB), wire bonding (WB), molded plastic packages (MPP), ceramic packages (CP), leadframe-based packages (LFBP) among others depending on customer requirements.
RF & Mixed-Signal Test Services
RF & mixed-signal test services involve testing semiconductors for radio frequency signals or analog/digital signals respectively using specialized equipment designed specifically for these purposes.
At Unisem ,we have invested heavily in this area by acquiring state-of-the-art RF/mixed-signal testers from leading manufacturers like Advantest Corporation among others .Our experienced engineers work closely with clients throughout all stages from design validation through production ramp-up ensuring optimal performance across all frequencies.
Why Choose Unisem?
There are many reasons why companies choose Unisem as their partner for semiconductor assembly and test services:
1) Experience: With over 30 years' experience in this field ,we have built up extensive knowledge about what works best when it comes down designing/manufacturing/testing semiconductors .
2) Quality: We take pride in delivering high-quality products at competitive prices while adhering strictly to international quality standards like ISO9001/TS16949/ISO14001 etc .
3) Technology: We invest heavily every year towards upgrading our facilities/equipment/software tools etc so you can rest assured knowing your product will be manufactured using cutting-edge technology .
4) Customer Service: Our team consists highly skilled professionals who work tirelessly around-the-clock ensuring timely delivery while providing excellent customer service/support throughout all stages from design validation through production ramp-up.
Conclusion:
In conclusion ,Unisem has established itself as one-stop-shop solution provider when it comes down designing/manufacturing/testing semiconductors .With its vast experience,knowledgeable staff,state-of-the-art facilities/equipment/software tools etc coupled with strict adherence international quality standards like ISO9001/TS16949/ISO14001 etc.,it's no wonder why many companies choose us time after time again!
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