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Stats chippac

4.3· 12 reviews
Average ratingGreat
4.3/ 5

Based on 12 reviews

550%
433%
317%
20%
10%

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About Stats chippac

STATS ChipPAC Pte. Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services for communication, consumer, and computing markets. Its services include post wafer fab process, and back-end assembly and test; document library; and package design center services for customers to determine the optimum package for complex integrated circuits.

Categories
Semiconductors