About Microbonds inc.

About company

Incorporated in 1996, Microbonds Inc. is a pioneer and leader in the research, development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. Microbonds™ proprietary chemistry invention was a key to their breakthrough in creating X-Wire™. Microbonds Inc. is now an applied materials technology company that develops unique surface coating technologies to address the emerging manufacturing and health challenges for a broad range of global industries and applications.