About APSTL

About company

Advanced Packaging is now recognized by the Designers of Electronic Systems as a key enabling technology, especially for the lucrative but very competitive Portable Systems segment. But access to even state of the art Packaging technologies such as Flip Chip and Wafer Level Packaging originally developed in the US are now channeled through large Assembly houses based in the Far East. To select and use these overseas providers of Advanced Packaging technologies, prospective users can benefit from both technical as well as logistical assistance by experts.